Takahiko Kato - Mitigating Tin Whisker Risks: Theory and Practice

1. Chapter 03
2. Chapter 04
3. Chapter 06
4. Chapter 07
5. Chapter 09

1. Chapter 01
2. Chapter 02
3. Chapter 03
4. Chapter 04
5. Chapter 05
6. Chapter 06
7. Chapter 07
8. Chapter 09

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Library of Congress Cataloging-in-Publication Data has been applied for

Hardback: 9780470907238

• Jasbir Bath; Bath Consultancy LLC, San Ramon, California, USA
• John E. Blendell; School of Materials Engineering, Purdue University, West Lafayette, Indiana, USA
• Eric Chason; Divison of Engineering, Brown University, Providence, Rhode Island, USA
• Wei-Hsun Chen; Cymer, Inc., San Diego, California, USA; School of Materials Engineering, Purdue University, West Lafayette, Indiana, USA
• Nicholas G. Clore; School of Materials Engineering, Purdue University, West Lafayette, Indiana, USA
• Min Ding; Freescale Semiconductor, Austin, Texas, USA
• Dennis D. Fritz; Science Applications International Corporation (SAIC), McLean, Virginia, USA
• Carol A. Handwerker; School of Materials Engineering, Purdue University, West Lafayette, Indiana, USA
• Nitin Jadhav; IBM, Hopewell Junction, New York, USA
• Takahiko Kato; Research & Development Group, Hitachi, Ltd., Tokyo, Japan; Center for Advanced Research of Energy and Materials, Hokkaido University, Sapporo, Japan
• John P. Koppes; Alcoa-Howmet, Whitehall, Michigan, USA
• Yukiko Mizuguchi; Advanced Materials Laboratory, Sony Corporation, Atsugi, Kanagawa, Japan
• Asao Nishimura; Jisso Partners, Inc., Tokyo, Japan
• Michael Osterman; Center of Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, Maryland, USA
• Aaron E. Pedigo; Naval Surface Warfare Center, Crane Division, Crane, Indiana, USA
• David Pinsky; Raytheon Integrated Defense Systems, Tewksbury, Massachusetts, USA
• Pylin Sarobol; Sandia National Laboratories, Albuquerque, New Mexico, USA
• Tadahiro Shibutani; Yokohama National University, Yokohama, Kanagawa, Japan
• Peng Su; Juniper Networks, Sunnyvale, California, USA
• Ying Wang; School of Materials Engineering, Purdue University, West Lafayette, Indiana, USA
• Maureen E. Williams; National Institute of Standards and Technology (NIST), Gaithersburg, Maryland, USA

The past few years have seen major research and development in the study of and understanding of tin whiskers with the continuing transition to lead-free assembly. This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies, written by international experts in these areas. The chapters listed here provide concise analyses of the current state of the art in the following tin whisker subjects:

• A Predictive Model for Whisker Formation Based on Local Microstructure and Grain Boundary Properties
• Major Driving Forces and Growth Mechanisms for Tin Whiskers
• Approaches of Modeling and Simulation of Stresses in Tin Finishes
• Properties and Whisker Formation Behavior of Tin-Based Alloy Finishes
• Characterization Techniques for Film Characteristics
• Overview of Whisker Mitigation Strategies for High-Reliability Electronic Systems
• Quantitative Assessment of Stress Relaxation in Tin Films by the Formation of Whiskers, Hillocks, and Other Surface Defects
• Board Reflow Processes and Their Effect on Tin Whisker Growth
• Mechanically Induced Tin Whiskers

reviews the characteristic properties of local microstructures around whisker and hillock grains with the aim to further identify why these particular grains and locations become predisposed to forming whiskers and hillocks. On the local level, factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution are discussed. A growth model is also discussed with a review on how it may be possible to engineer a whisker-resistant texture for the appropriate aging condition.