Donovan - Particle Control for Semiconductor Manufacturing
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There is something Alice-in-Wonderlandish about powerful and vital computer systems being shut down by a microscopic mote that a hay-feverist wouldnt sneeze at, but as computer chips get smaller, smaller and smaller particles on their surface have a larger and larger effect on their performance. In
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Semiconductors--Design and construction, Semiconductors--Defects, Particles.
publication date
:
1990
lcc
:
TK7871.85.P358 1990eb
ddc
:
621.381/52
subject
:
Semiconductors--Design and construction, Semiconductors--Defects, Particles.
Page i
Particle Control for Semiconductor Manufacturing
R. P. Donovan
Center for Aerosol Technology Research Triangle Institute Research Triangle Park, North Carolina
Page ii
Library of Congress Cataloging-in-Publication Data Donovan, R. P. Partical control for semiconductor manufacturing / Robert P. Donovan. p. cm. Includes bibliographical references. ISBN 0-8247-8242-9 (alk. paper) 1. Semiconductors--Design and construction. 2. Semiconductors -Defects. 3. Particles. I. Title. TK7871.85.D647 1990 621.381'52--dc20 89-49025 CIP
This book is printed on acid-free paper
Copyright 1990 by MARCEL DEKKER, INC. All Rights Reserved
Neither this book nor any part may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying, microfilming, and recording, or by any information storage and retrieval system, without permission in writing from the publisher.
MARCEL DEKKER, INC. 270 Madison Avenue, New York, New York 10016
As used in this book, the term particle refers to a stable or quasi-stable agglomeration of molecules, forming a discrete liquid or solid entity, typically 2 nm to 1 mm in size. Particles exist everywhere in nature, as both living and inorganic entities and are generated in most industrial processes. The ambient air and water of the planet contain huge concentrations of particles. Only with painstaking difficulty can a surface, be it a lens mirror or silicon wafer, be made particle-free.
Large particles-those exceeding 50100 mm in size-can be readily seen by the naked eye. On the other hand, small submicrometer particles require high-quality microscopes or electron microscopes to be detected. At the lower end of the size range specified in the particle definition, the distinction between a particle and a large molecule begins to blur. The concern of the semiconductor industry has been with smaller and smaller particles as device geometry itself has become smaller and smaller. Thus, the emphasis in this book is on submicrometer particles. Particles as small as 0.1 mm (100 nm) are now widely recognized as potential "killer" particles. Because of their growing importance, that size particle and those in the size decade below 0.1mm are of special concern.
Because of the ubiquitous nature of these particles and because their dimensions are of the same order of magnitude as the dimensions of the devices on today's silicon chips, particles constitute a serious threat to chip yield, introducing unplanned and undesired deviations in the designed structure. These deviations can come about primarily as alterations in either the artwork photolithographically transferred to a wafer surface or in the bulk electrical/structural properties of the chip because of impurities introduced by the particle or both. In any event, the relationship between particulate contamination and yield, while not necessarily simple, is direct, and no debate exists regarding the destructive role of the extraneous particles found on wafer surfaces during processing.
This book is an introduction to the measurement and control of the contaminating particles that plague the manufacturing of silicon chips. These particles introduce unwanted, unmodeled effects into device performance, often resulting in chip failure. Their presence has been estimated to account for anywhere from one-third to two-thirds of the failures detected at wafer probe. The trend toward chip designs of ever decreasing dimensions promises increased sensitivity to particle control practices.
While no letup in particle vulnerability is in sight-indeed quite the reverse-increased awareness of the particle threat at all levels of manufacturing has resulted in significant progress in combatting the particle menace. Particle detection methods-in gases, in liquids, and on surfaces-have improved dramatically; particle generation as a factor in the design of wafer processing equipment is now universally recognized; management now generally supports increased resources and personnel for particle control.
This book reviews this recent progress. It is an introduction to the particle problems of silicon device manufacturing and their solution. While it is written primarily for the particle control novice and includes considerable background fundamentals, it also describes many state-of-the-art practices so that the practitioner can also find information of value in responding to his daily challenges. The goals of the book are to summarize what has been learned over past years in understanding particle problems and what has been successful in minimizing the deleterious effects of particles on device yield.
Page iv
This book is an updated revision of the course notes distributed at a short course entitled Particle Control in Semiconductor Manufacturing that was presented for the first time on April 1921, 1988, in Research Triangle Park, North Carolina. The course was organized by researchers at the Research Triangle Institute who have participated in Semi-conductor Research Corporation (SRC)-sponsored research in manufacturing science over the past 5 years. The course syllabus included much of this SRC-sponsored research and the course staff included many of these researchers. In addition, however, the staff also included a university professor, an instrument vendor, a gas vendor, a chemical vendor, and three semiconductor technologists who, through the eyes of a chip manufacturer, have developed an appreciation for the importance and the subtleties of particles and particle problems to the successful manufacturing of today's silicon chips.
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