Woodhead Publishing. - Handbook of Metal Injection Molding

Second Edition

Donald F. Heaney

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Notices

Knowledge and best practice in this field are constantly changing. As new research and experience broaden our understanding, changes in research methods, professional practices, or medical treatment may become necessary.

Practitioners and researchers must always rely on their own experience and knowledge in evaluating and using any information, methods, compounds, or experiments described herein. In using such information or methods they should be mindful of their own safety and the safety of others, including parties for whom they have a professional responsibility.

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ISBN: 978-0-08-102152-1 (print)

ISBN: 978-0-08-102809-4 (online)

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S. Ahn Pusan National University, Busan, South Korea

S.V. Atre University of Louisville, Louisville, KY, United States

S. Banerjee

DSH Technologies LLC, Cedar Grove, NJ

Holo Inc., Oakland, CA, United States

C. Binet Advanced Powder Products, Inc., Philipsburg, PA, United States

S.H. Chung Hyundai Steel Co., Incheon, South Korea

S.T. Chung CetaTech Inc., Sacheon, South Korea

T. Ebel Helmholtz-Zentrum Geesthacht, Geesthacht, Germany

R.K. Enneti Global Tungsten and Powders, Towanda, PA, United States

R.M. German San Diego State University, San Diego, CA, United States

C.D. Greene Treemen Industries, Inc., Boardman, OH, United States

O. Gulsoy Marmara University, Istanbul, Turkey

D.F. Heaney Advanced Powder Products, Inc., Philipsburg, PA, United States

Gemma Herranz University of Castilla La Mancha, INEI-ETSII, Ciudad Real, Spain

J. Hidalgo Delft University of Technology, Delft, The Netherlands

K. Horke Joint Institute of Advanced Materials and Processes, Friedrich-Alexander Universitt Erlangen-Nrnberg, Germany

K.S. Hwang National Taiwan University, Taipei, Taiwan, ROC

C.J. Joens Elnik Systems LLC, Cedar Grove, NJ, United States

J.L. Johnson Elmet Technologies LLC, Lewiston, ME, United States

T.G. Kang Korea Aerospace University, Goyang, South Korea

K.H. Kate University of Louisville, Louisville, KY, United States

Y.S. Kwon CetaTech Inc., Sacheon, South Korea

H. Lobo DatapointLabs, Ithaca, NY, United States

M. Martens Formatec Ceramics, DV Goirle, The Netherlands

A. Meyer Joint Institute of Advanced Materials and Processes, Friedrich-Alexander Universitt Erlangen-Nrnberg, Germany

H. Miura Kyushu University, Fukuoka, Japan

N.S. Myers Kennametal, Inc., Pittsburgh, PA, United States

K. Nishiyabu Kindai University, Higashisaka, Japan

V.P. Onbattuvelli Intel Corporation, Santa Clara, CA, United States

S.J. Park POSTECH, Pohang, South Korea

V. Piotter Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany

G. Schlieper Gammatec Engineering GmbH, Radevormwald, Germany

R.F. Singer Neue Materialien Frth GmbH, Germany

J.T. Strauss HJE Company, Inc., Queensbury, NY, United States

P. Suri Heraeus Materials Technology LLC, Singapore, Singapore

J.M. Torralba Institute IMDEA Materials, Universidad Carlos III de Madrid, Madrid, Spain

P. Vervoort Eisenmann Thermal Solutions, Bovenden, Germany

R.M. German San Diego State University, San Diego, CA, United States