Xing-Chang Wei - Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging Xing-Chang Wei CRC Press Taylor & Francis Group 6000 Broken Sound Parkway NW, Suite 300 Boca Raton, FL 33487-2742 2017 by Taylor & Francis Group, LLC CRC Press is an imprint of Taylor & Francis Group, an Informa business No claim to original U.S. Government works Printed on acid-free paper International Standard Book Number-13: 978-1-1380-3356-6 (Hardback) This book contains information obtained from authentic and highly regarded sources. Reasonable efforts have been made to publish reliable data and information, but the author and publisher cannot assume responsibility for the validity of all materials or the consequences of their use. The authors and publishers have attempted to trace the copyright holders of all material reproduced in this publication and apologize to copyright holders if permission to publish in this form has not been obtained. If any copyright material has not been acknowledged please write and let us know so we may rectify in any future reprint. Except as permitted under U.S.

Copyright Law, no part of this book may be reprinted, reproduced, transmitted, or utilized in any form by any electronic, mechanical, or other means, now known or hereafter invented, including photocopying, microfilming, and recording, or in any information storage or retrieval system, without written permission from the publishers. For permission to photocopy or use material electronically from this work, please access www.copyright. com (http://www.copyright.com/) or contact the Copyright Clearance Center, Inc. (CCC), 222 Rosewood Drive, Danvers, MA 01923, 978-750-8400. CCC is a not-for-profit organization that provides licenses and registration for a variety of users. Trademark Notice: Product or corporate names may be trademarks or registered trademarks, and are used only for identification and explanation without intent to infringe. Library of Congress Cataloging-in-Publication Data Names: Wei, Xing-Chang, author. Library of Congress Cataloging-in-Publication Data Names: Wei, Xing-Chang, author.

Title: Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging / Xing-Chang Wei. Description: Boca Raton : CRC Press, Taylor & Francis Group, [2017] | Includes bibliographical references and index. Identifiers: LCCN 2016053999 | ISBN 9781138033566 (hardback : alk. paper) | ISBN 9781315305875 (ebook) Subjects: LCSH: Printed circuits--Design and construction. | Electronic packaging. | Electromagnetic compatibility.

Classification: LCC TK7868.P7 W44 2017 | DDC 621.3815/31--dc23 LC record available at https://lccn.loc.gov/2016053999 Visit the Taylor & Francis Web site at http://www.taylorandfrancis.com and the CRC Press Web site at http://www.crcpress.com Contents CRC Press Taylor & Francis Group 6000 Broken Sound Parkway NW, Suite 300 Boca Raton, FL 33487-2742 2017 by Taylor & Francis Group, LLC CRC Press is an imprint of Taylor & Francis Group, an Informa business No claim to original U.S. Government works Printed on acid-free paper International Standard Book Number-13: 978-1-1380-3356-6 (Hardback) This book contains information obtained from authentic and highly regarded sources. Reasonable efforts have been made to publish reliable data and information, but the author and publisher cannot assume responsibility for the validity of all materials or the consequences of their use. The authors and publishers have attempted to trace the copyright holders of all material reproduced in this publication and apologize to copyright holders if permission to publish in this form has not been obtained. If any copyright material has not been acknowledged please write and let us know so we may rectify in any future reprint. Except as permitted under U.S.

Copyright Law, no part of this book may be reprinted, reproduced, transmit ted, or utilized in any form by any electronic, mechanical, or other means, now known or hereafter invented, including photocopying, microfilming, and recording, or in any information storage or retrieval system, without written permission from the publishers. For permission to photocopy or use material electronically from this work, please access www.copyright. com (http://www.copyright.com/) or contact the Copyright Clearance Center, Inc. (CCC), 222 Rosewood Drive, Danvers, MA 01923, 978-750-8400. CCC is a not-for-profit organization that provides licenses and registration for a variety of users. Trademark Notice: Product or corporate names may be trademarks or registered trademarks, and are used only for identification and explanation without intent to infringe. Visit the Taylor & Francis Web site athttp://www.taylorandfrancis.comand the CRC Press Web site athttp://www.crcpress.comvviContentsContentsviiviiiContentsContentsixxContents A high-speed circuit is the base of contemporary information and communication technology (ICT) and consumer electronics. Visit the Taylor & Francis Web site athttp://www.taylorandfrancis.comand the CRC Press Web site athttp://www.crcpress.comvviContentsContentsviiviiiContentsContentsixxContents A high-speed circuit is the base of contemporary information and communication technology (ICT) and consumer electronics.

Our modern life is heavily dependent on the functioning of high-speed circuits developed for various purposes. Therefore, the electromagnetic compatibility (EMC) among various circuits becomes very important. Because of ever-increasing clock frequencies and their harmonics, the electromagnetic field spectrum on the printed circuit board (PCB) and inside the electronic package extends to several tens of gigahertz. With decreased wave lengths, the electromagnetic wave phenomenon on the PCB and inside the package is obvious. This makes the signal spread over the entire PCB and package instead of confirming along the traces. At the same time, the three-dimensional integra tion including the through silicon via (TSV) based system-in-package (SiP) greatly increases the circuit density and complexity.

Such a high frequency and a high density become a big challenge for the EMC control of high-speed circuits. This book presents EMC modeling and control methods based on the authors many years of research. The emphasis of this book is placed on two essential passive components of a high-speed circuit: the power distribution network and the sig nal distribution network. The field-circuit hybrid modeling and simulation meth ods of these passive components are discussed in detail. In addition, this book also explores the applications of novel structures and materials, including high impedance surfaces and graphene films, in the EMC design, where the traditional bulk EMC materials cannot be used. The signal integrity (SI), power integrity (PI), and electromagnetic interfer ence (EMI) are three major EMC issues related to a high-speed circuit.

For each of them, there are lots of EMC problems. Because of this diversity, the EMC is always analyzed and designed on a case-by-case basis. An EMC beginner usually finds it difficult to know where to start. However, behind all EMC problems is the behavior of the electromagnetic field in different environments. The study of the electromagnetic field characteristics is the key to better understand EMC problems and their control methods. The electromagnetic modeling is very important and is the best way to accurately get an insight into the electromagnetic phenomena.