Peter S. Gaal - Thermal Conductivity 24 Thermal Expansion 12

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title	:	Thermal Conductivity 24, Thermal Expansion 12
author	:	Gaal, Peter S.
publisher	:	Taylor & Francis Routledge
isbn10 | asin	:	1566767113
print isbn13	:	9781566767118
ebook isbn13	:	9780585349558
language	:	English
subject	Heat--Conduction--Congresses, Solids--Thermal properties--Congresses, Materials--Thermal properties--Congresses.
publication date	:	1997
lcc	:	QC320.8.I58 1997eb
ddc	:	536/.2012
subject	:	Heat--Conduction--Congresses, Solids--Thermal properties--Congresses, Materials--Thermal properties--Congresses.

Page i Thermal Conductivity 24 Thermal Expansion 12 JOINT CONFERENCES October 2629, 1997 Pittsburgh, Pennsylvania, USA Peter S. Gaal Conference Chairman Editor of Proceedings Daniela E. Apostolescu Vice Chair - Publications Co-Editor of Proceedings Edward P. Hurst, II Vice Chair - Logistics CONFERENCE HOST Anter Corporation, Pittsburgh, Pennsylvania, USA

Page ii HOW TO ORDER THIS BOOK BY PHONE: 800-233-9936 or 717-291-5609, 8AM5PM Eastern Time BY FAX: 717-295-4538 BY MAIL: Order Department Technomic Publishing Company, Inc. 851 New Holland Avenue, Box 3535 Lancaster, PA 17604, U.S.A. BY CREDIT CARD: American Express, VISA, MasterCard BY WWW SITE: http://WWW.techpub.com PERMISSION TO PHOTOCOPYPOLICY STATEMENT Authorization to photocopy items for internal or personal use, or the internal or personal use of specific clients, is granted by Technomic Publishing Co., Inc. provided that the base fee of US $3.00 per copy, plus US $.25 per page is paid directly to Copyright Clearance Center, 222 Rosewood Drive, Danvers, MA 01923, USA. For those organizations that have been granted a photocopy license by CCC, a separate system of payment has been arranged. The fee code for users of the Transactional Reporting Service is 1-56676/99 $5.00 + $.25.

Page iii Sessions and Session Chairmen Diamonds / Films 1: Ludovit Kubicar*, Institute of Physics SAS, Slovakia Diamonds / Films 2: Ralph Dinwiddie, Oak Ridge National Laboratory, USA Theory: Paul Klemens, University of Connecticut, USA (retired) Thermal Diffusivity 1: Tetsuya Baba, National Research Laboratory of Metrology, Japan Thermal Diffusivity 2: Ralph Dinwiddie, Oak Ridge National Laboratory, USA (substituted for Ared Cezairliyan) Composites: Raymond Taylor, Thermophysical Properties Research Laboratory, Inc., USA Coatings: D. P. H. Hasselman, Virginia Polytechnic Institute, USA Transient Methods: Donald Morelli, General Motors Corporation, USA Thermal Expansion 1: Ernest Wolff, Oregon State University, USA Thermal Expansion 2: Henry Hagy, Corning Inc., USA (retired) Insulations: Ronald Tye, ULVAC Sinku-Riko, Japan Molten State: R. Anthony Overfelt, Auburn University, USA Fluids: William Wakeham, Imperial College, UK Standard Reference Materials 1: R. Keith Kirby, National Institute of Standards and, Technology, USA (retired) Standard Reference Materials 2: Kosta Maglic,* Institute of Nuclear Sciences "VINCA", Yugoslavia Applications: J. Fricke, University of Wrzburg, Germany Mixed Data 1: David Yarbrough, Tennessee Technological University, USA Mixed Data 2: T. Ashworth, South Dakota School of Mines and Technology, USA Potpourri 1: Jack Henderson, Netzsch Gertebau GmbH, Germany Potpourri 2: David McElroy, Oak Ridge National Laboratory, USA (retired)

Page iv Technomic Publishing Company, Inc. 851 New Holland Avenue, Box 3535 Lancaster, Pennsylvania 17604 U.S.A. Copyright 1999 by Technomic Publishing Company, Inc. All rights reserved No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. Printed in the United States of America 10 9 8 7 6 5 4 3 2 1 Main entry under title: Thermal Conductivity 24 A Technomic Publishing Company book Bibliography: p. ISBN No. 1-56676-711-3 ISSN 0163-9005

Page v TABLE OF CONTENTS Preface xiii Memory of a Friend xvii Keynote Lectures Giuseppe Ruffino Memorial Lecture

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