Krishna Seshan - Handbook of Thin Film Deposition

1. Tables in Chapter 1
2. Tables in Chapter 2
3. Tables in Chapter 3
4. Tables in Chapter 4
5. Tables in Chapter 5
6. Tables in Chapter 6
7. Tables in Chapter 8
8. Tables in Chapter 10
9. Tables in Chapter 11
10. Tables in Chapter 13

1. Figures in Chapter 1
2. Figures in Chapter 2
3. Figures in Chapter 3
4. Figures in Chapter 4
5. Figures in Chapter 5
6. Figures in Chapter 6
7. Figures in Chapter 7
8. Figures in Chapter 8
9. Figures in Chapter 9
10. Figures in Chapter 10
11. Figures in Chapter 11
12. Figures in Chapter 12
13. Figures in Chapter 13

Fourth Edition

Edited by

Krishna Seshan

Retired, Intel Corporation, United States

Dominic Schepis

Globalfoundries, East Fishkil, NY, United States

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Notices

Knowledge and best practice in this field are constantly changing. As new research and experience broaden our understanding, changes in research methods, professional practices, or medical treatment may become necessary.

Practitioners and researchers must always rely on their own experience and knowledge in evaluating and using any information, methods, compounds, or experiments described herein. In using such information or methods they should be mindful of their own safety and the safety of others, including parties for whom they have a professional responsibility.

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A catalog record for this book is available from the Library of Congress

ISBN: 978-0-12-812311-9

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Publisher: Matthew Deans

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Editorial Project Manager: Capille, Gabriela D.

Production Project Manager: Vijayaraj Purushothaman

Cover Designer: Rogers, Mark

Typeset by MPS Limited, Chennai, India

We dedicate this book to our families who have supported us and our teachers who have taught us.

To the memory of Dr. Krishna Seshan, accomplished scientist, inspiring editor, good friend, and whose dream made this handbook a reality.

Takashi Ando , IBM T. J. Watson Research Center, Yorktown, NY, United States

Michael Belyansky , IBM Research, Albany, NY, United States

Elham R. Borujeny , University of Alberta, Edmonton, AB, Canada

Ken Cadien , University of Alberta, Edmonton, AB, Canada

Kenneth C. Cadien , University of Alberta, Edmonton, AB, Canada

Jin Cai , IBM Research, Yorktown, NY, United States

Loren A. Chow , Intel Corporation, Santa Clara, CA, United States

Keith D. Coulson , University of Illinois, Urbana, IL, United States

Robert H. Dennard , IBM Research, Yorktown, NY, United States

Jeff Gambino , ON Semiconductor, Gresham, OR, United States

Dhruv Gelda , University of Illinois, Urbana, IL, United States

S.B. Herner , Glo USA, Inc., Sunnyvale, CA, United States

Arvind Kumar , IBM Research, Yorktown, NY, United States

Angus Macleod , Thin Film Center Inc., Tucson, AZ, United States

Mengmeng Miao , University of Alberta, Edmonton, AB, Canada

Triratna Muneshwar , University of Alberta, Edmonton, AB, Canada

Lucy Nolan , University of Alberta, Edmonton, AB, Canada

Rajan K. Pandey , Globalfoundries, Malta, NY, United States

Manjunath C. Rajagopal , University of Illinois, Urbana, IL, United States

Dominic Schepis , Globalfoundries, Malta, NY, United States

Krishna Seshan

University of Arizona, Tucson, AZ, United States

Intel Corporation, retired

Shahab Siddiqui , Globalfoundries, Malta, NY, United States

Andrew H. Simon , Globalfoundries, Malta, NY, United States

Sanjiv Sinha , University of Illinois, Urbana, IL, United States

Krishna V. Valavala , University of Illinois, Urbana, IL, United States