Banqiu Wu - 3D IC Stacking Technology

3D IC Stacking
Technology

3D IC Stacking
Technology

Banqiu Wu

Ajay Kumar

Sesh Ramaswami

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ISBN 978-0-07-174196-5
MHID 0-07-174196-8

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Contents

1 Introduction to High-Density Through Silicon
Stacking TechnologyMatthew Nowak

1.3.2 Examples of Architectural Uniqueness
from Through Silicon Stacking

2 A Practical Design Eco-System for Heterogeneous
3D IC ProductsRiko Radojcic

2.1.2 Causes for Incremental Design
Specification Instability in 3D

3 Design Automation and TCAD Tool Solutions
for Through Silicon ViaBased 3D IC Stack
Jamil Kawa and Xiaopeng Xu

4 Process Integration for TSV Manufacturing
Sesh Ramaswami

5 High-Aspect-Ratio Silicon Etch for TSV
Banqiu Wu and Ajay Kumar

6 Dielectric Deposition for Through Silicon Vias
Heung Lak Park, Ran Ding, and Kedar Sapre

7 Barrier and Seed DepositionJohn Forster and
Praburam Gopalraja

8 Copper Electrodeposition for TSV
Rozalia Beica

9 Chemical Mechanical Polishing for TSV
ApplicationsYuchun Wang, Max Gage,
Wen-Chiang Tu, and Lakshmanan Karuppiah

10 Temporary and Permanent BondingBioh Kim,
Matthias Thorsten, Dragoi Viorel,
Markus Wimplinger, and Paul Lindner

11 Assembly and Test Aspects of TSV Technology
Robert Darveaux, Rick Reed, Ki Wook Lee, Mark Berry,
Ron Huemoeller, Seong Min Seo, Jesse Galloway,
Nozad Karim, Jae Dong Kim, and
Choon Heung Lee

Contributors

Rozalia BeicaApplied Materials, Inc., Santa Clara, California ( CHAP . 8)

Mark BerryAmkor Technology, Inc., Chandler, Arizona ( CHAP . 11)

Robert DarveauxAmkor Technology, Inc., Chandler, Arizona ( CHAP . 11)

Ran DingApplied Materials, Inc., Sunnyvale, California ( CHAP . 6)

John ForsterApplied Materials, Inc., Sunnyvale, California ( CHAP . 7)

Max GageApplied Materials, Inc., Sunnyvale, California ( CHAP . 9)

Jesse GallowayAmkor Technology, Inc., Chandler, Arizona ( CHAP . 11)

Praburam GopalrajaApplied Materials, Inc., Sunnyvale, California ( CHAP . 7)

Ron HuemoellerAmkor Technology, Inc., Chandler, Arizona ( CHAP . 11)

Nozad Karim